Thermal head, thermal head unit, and method of manufacture thereof
US6686945B1 · kind B1 · utility
4Cited by
0References
28Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 6, 2001 |
| Grant date | Feb 3, 2004 |
| Priority date | — |
| Expiry date | Apr 6, 2021 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB41J2/345
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
A thermal head has a head chip having an upper surface, a lower surface and a side surface. Heating elements are disposed on the upper surface of the head chip, and electrodes are disposed on the upper surface of the head chip and connected to the heating elements. A wiring substrate is disposed on the lower surface of the head chip. A semiconductor integrated circuit is mounted on the wiring substrate and is in contact with the side surface of the head chip and connected to the electrodes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.