Cooling system for integrated circuit chip
US6687125B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 28, 2002 |
| Grant date | Feb 3, 2004 |
| Priority date | — |
| Expiry date | Jun 28, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In a cooling system for an integrated circuit chip, by including an evaporator contacted-combined with an integrated circuit chip installed onto a board and absorbing heat generated at the integrated circuit chip; a compressor connected to the evaporator by a first connection pipe; a condenser connected to the compressor by a second connection pipe; an expansion means connected to the condenser by a third connection pipe and simultaneously connected to the evaporator by a fourth connection pipe; and a mounting board installed onto the board by a board combining means and mounted with the compressor, the condenser and the expansion means, it is possible to perform the operation of the integrated circuit chip smoothly, and accordingly a reliability of a product can be improved. In addition, although an integrated circuit chip is getting even more integrated, cooling of the integrated circuit chip can be efficiently performed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.