Wave solder apparatus and method
US6688511B2 · kind B2 · utility
5Cited by
28References
30Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 16, 2002 |
| Grant date | Feb 10, 2004 |
| Priority date | — |
| Expiry date | Jan 16, 2022 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K3/0653
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method of soldering a circuit board comprises moving a circuit board through various stations including a preheater station and a solder station.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.