Facing target assembly and sputter deposition apparatus
US6689253B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 13, 2002 |
| Grant date | Feb 10, 2004 |
| Priority date | — |
| Expiry date | Jun 13, 2022 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG11B7/266
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A facing target sputtering apparatus, comprising:inner and outer spaced-apart, concentric, and coextensive tubular cathodes open at each end, with the inwardly facing surface of the outer cathode and the outwardly facing surface of the inner cathode;a first pair of ring-shaped magnet means extending around the outwardly facing surface of the outer cathode at the ends thereof, with a first polarity magnetic pole facing the outwardly facing surface;a second pair of ring-shaped magnet means extending around the inwardly facing surface of the inner cathode at the ends thereof, with a second, opposite polarity magnetic pole facing the inwardly facing surface; anda substrate positioned in spaced adjacency to an end of the inner and outer cathodes; wherein:magnetic flux lines from the first and second pairs of magnet means uni-directionally pass through portions of an annularly-shaped space between the ends of the inner and outer cathodes, and during sputtering operation, plasma is substantially confined to the portion of the annularly-shaped space between the magnetic flux lines.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.