Micromechanical system fabrication method using (111) single crystalline silicon
US6689694B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 17, 2000 |
| Grant date | Feb 10, 2004 |
| Priority date | — |
| Expiry date | Nov 17, 2020 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81C2201/014
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Disclosed is a micromechanical system fabrication method using (111) single crystalline silicon as a silicon substrate and employing a reactive ion etching process in order to pattern a microstructure that will be separated from the silicon substrate and a selective release-etching process utilizing an aqueous alkaline solution in order to separate the microstructure from the silicon substrate. According to the micromechanical system fabrication method of the present invention, the side surfaces of microstructures can be formed to be vertical by employing the RIE technique. Furthermore, the microstructures can be readily separated from the silicon substrate by employing the selective release-etching technique using slow etching {111} planes as the etch stop in an aqueous alkaline solution. In addition, etched depths can be adjusted during the RIE step, thereby adjusting the thickness of the microstructure and the spacing between the microstructure and the silicon substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.