Molding compounds with reduced adhesiveness use in the automobile industry

US6689838B1 · kind B1 · utility

Assignee

• BASF SE

Inventors

• Michael Fischer · Ludwigshafen, DE
• Walter Rau · Großweil, DE

Key dates

• Filing date: Dec 19, 2001
• Grant date: Feb 10, 2004
• Expiry date: Dec 19, 2021

Classification

• Technology area (CPC C): Chemistry; Metallurgy
• CPC primary: C08L51/04
• WIPO field: Macromolecular chemistry, polymers
• WIPO sector: Chemistry

Abstract

The invention relates to a molding composition comprising, based on the total of components A to G, which is 100% by weight,a) as component A of the molding composition, from 1 to 99,59% by weight of at least one polycondensate,b) as component B, from 0.1 to 20% by weight of at least one particulate graft copolymer with a glass transition temperature of the soft phase below 0° C. and with a median particle size of from 50 to 1000 nm,c) as component C, from 0.1 to 20% by weight of at least one copolymer made from the following monomersc1) as component C1, from 50 to 90% by weight of at least one vinylaromatic monomer, andc2) as component C2, from 10 to 50% by weight of acrylonitrile and/or methacrylonitrile, in each case based on component C,d) as component D, from 0 to 20% by weight of a copolymer similar to component C, where the content in % by weight of acrylonitrile and/or methacrylonitrile in component C differs from that in component D,e) as component E, from 0.1 to 20% by weight of a polyester other than component A,f) as component F, from 0.01 to 10% by weight of at least one nucleating agent and of at least one transesterification stabilizer, where the ratio by weight …