Housing for an electronic component
US6690254B2 · kind B2 · utility
4Cited by
9References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 2, 2002 |
| Grant date | Feb 10, 2004 |
| Priority date | — |
| Expiry date | Feb 25, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/301
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A housing for an electronic component has a set of walls for surrounding the component. The component is snap-fitted into the housing to retain it in the housing through snap-fit features in the housing and snap-fit features on the component. The housing can incorporate springs which, in use, bias the component into contact with the snap-fit features. If the component is a transformer, the springs can act on the transformer laminations to press the stack of laminations together while biasing the component into contact with the snap-fit features.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.