Cooling device
US6690578B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Nov 25, 2002 |
| Grant date | Feb 10, 2004 |
| Priority date | — |
| Expiry date | Nov 25, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20454
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A cooling device for cooling one or more electrical and/or electronic components, also referred to as E-components. The cooling device includes at least one cooling body which is assigned to the E-component and which is connected to the same in a thermoconductive manner. According to this invention, it is possible to achieve an effective heat exchange and thus a high operating efficiency in such a system. Thus, according to this invention the cooling body is in thermoconductive contact with a granular, liquid or pasty filling material that is capable of conducting heat. The liquid or pasty material is retained at least in areas by a flexible membrane, and the membrane is connected to a surface of the E-component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.