Electronic packaging device and method
US6691398B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Oct 2, 2002 |
| Grant date | Feb 17, 2004 |
| Priority date | — |
| Expiry date | Oct 2, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A device for electrically interconnecting and packaging electronic components and method for manufacturing the device. A non-conducting base member having a component recess and a plurality of specially shaped lead channels formed therein is provided. At least one electronic component is disposed within the recess, and the wire leads of the component are routed through the lead channels. A plurality of lead terminals, adapted to cooperate with the specially shaped lead channels, are received within the lead channels, thereby forming an electrical connection between the lead terminals and the wire leads of the electronic component(s). The special shaping of the lead channels and lead terminals restricts the movement of the lead terminals within the lead channels in multiple directions during package fabrication, thereby allowing for the manufacture of larger, more reliable devices. In another aspect of the invention, the device includes a series of specially shaped through-holes provided within the base member to allow the routing of wire leads there through. The bottom surface of the base member is chamfered to facilitate “wicking” of molten solder up the wire leads dur…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.