Cooling apparatus
US6691770B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jun 5, 2002 |
| Grant date | Feb 17, 2004 |
| Priority date | — |
| Expiry date | Jun 5, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldPharmaceuticals
- WIPO sectorChemistry
Abstract
A heat sink comprises a core member comprising at least one core member first surface. The core member first surface is adapted to contact or be located adjacent at least a portion of the heat source. At least one outer peripheral surface is located on the core member. At least one cooling fin is operatively connected to the outer peripheral surface and extends in a direction substantially normal to the core member first surface. At least a portion of the outer peripheral surface is tapered, wherein the circumference of the outer peripheral surface in the proximity of the first surface is greater than the circumference of the outer peripheral surface not in the proximity of the first surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.