Micromachined scanning thermal probe method and apparatus
US6692145B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 31, 2001 |
| Grant date | Feb 17, 2004 |
| Priority date | — |
| Expiry date | Oct 31, 2021 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01K7/028
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A micromachined thermal probe has a substrate with a surface and an edge, and at least one flexible probe body formed on the substrate that includes a cantilever beam section that extends from a proximal end outwardly to a distal end. A pair of conductors in the probe body extend to a junction at the distal end at which is formed a probe tip. Current passed through the conductors to the junction heats the probe tip, with changes in the effective probe resistance occurring as the probe tip is scanned over a sample with different thermal conductivities at different positions. A second flexible probe body may be mounted to the substrate and constructed similarly to the first probe body to act as a reference probe to allow compensation of the first probe. The probe body may be formed of layers of flexible polymer joined together over pairs of conductors, which is bent back onto itself and secured together at a proximal end of the cantilever beam.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.