Non-thermal plasma reactor and method-structural conductor

US6692704B2 · kind B2 · utility

Assignee

• Delphi Technologies · US

Inventors

• David Emil Nelson · Waterford Township, US
• Bob Li · Grand Blanc, US
• Mark Hemingway · Columbiaville, US
• Suresh Baskaran · Kennewick, US
• Joachim Kupe · Davisburg, US
• Gregory Stephen Sims · Detroit, US
• Delbert L. Lessor · Richland, US
• Carl Elmer Miller · Millington, US
• Darrell R. Herling · Kennewick, US

Key dates

• Filing date: Mar 19, 2001
• Grant date: Feb 17, 2004
• Expiry date: Mar 19, 2021

Classification

• Technology area (CPC H): Electricity
• CPC primary: H05H2245/15
• WIPO field: Chemical engineering
• WIPO sector: Chemistry

Abstract

A non-thermal plasma (NTP) reactor structural conductor element includes a base conductor support and a high dielectric constant (“high k”) barrier layer supported by and substantially surrounding the base conductor support to form a structural conductor NTP reactor element. The structural conductor element may comprise a variety of shapes such as plates, sheets, half-box, I shapes, C shapes, or comb shapes, among others. In one embodiment, the dielectric barrier layer includes a coating applied to the base conductor support. In another embodiment, the dielectric barrier layer includes a high k film laminated to the base conductor support. In yet another embodiment, the base conductor support integrally forms the dielectric barrier layer via conversion of surfaces of the base conductor using electrochemical, thermal or chemical means to form the dielectric barrier layer.