Method for encapsulating components

US6692986B1 · kind B1 · utility

Assignee

• OSRAM Opto Semiconductors GmbH · DE

Inventors

• Heiner Bayer · Olching, DE
• Wolfgang Rogler · Erlangen, DE
• Wolfgang Roth · Zweibrücken, DE

Key dates

• Filing date: Jun 25, 2002
• Grant date: Feb 17, 2004
• Expiry date: Jun 25, 2022

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10K50/8426

Abstract

A method of encapsulating components based on organic semiconductors, includes adhesively bonding a housing to a substrate. Bonding is carried out using a UV-curable reactive adhesive including an epoxy resin, a hydroxy-functional reaction product of an epoxide compound with a phenolic compound, a silane-type adhesion promoter, and a photoinitiator, and also if desired, filler. This method is used in particular for encapsulating organic light-emitting diodes (OLEDs).