Hardened Fe-Ni alloy for the manufacture of integrated circuit leaderframes and manufacturing process
US6692992B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 26, 2002 |
| Grant date | Feb 17, 2004 |
| Priority date | — |
| Expiry date | Nov 26, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A method of making a Fe-Ni strip whose chemical composition comprises, by weight: 36% ≦Ni+Co≦43%; 0%≦Co≦3%; 0.05%≦C≦0.4%; 0.2%≦Cr≦1.5%; 0.4%≦Mo≦3%; Cu≦3%; Si≦0.3%, Mn≦0.3%; the rest being iron and impurities, the alloy having an elastic limit Rp0.2 more than 750 Mpa and a distributed elongation Ar more than 5%. The alloy is optionally recast under slag. The strip is obtained by hot-rolling above 950° C., then cold-rolling and carrying out a hardening treatment between 450° C. and 850° C., the hardening heat treatment being preceded by a reduction of at least 40%. The invention is useful for making integrated circuit support grids and electronic gun grids.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.