Multichip module having chips mounted on upper and under surfaces of a thin film closing an opening formed in a rigid substrate
US6693362B2 · kind B2 · utility
22Cited by
4References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 20, 2001 |
| Grant date | Feb 17, 2004 |
| Priority date | — |
| Expiry date | Nov 20, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1572
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A multichip module is provided. The multichip module comprises a rigid substrate including a core material and having an opening, a thin film fixed on an upper surface of the rigid substrate so as to be electrically connected to the rigid substrate and to close the opening, a first chip mounted on the upper surface of the thin film, and a second chip mounted on the under surface of the thin film so as to be located in the opening of the rigid substrate. The rigid substrate and the thin film form a wiring substrate having a composite structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.