Interconnect structure for electronic devices
US6693384B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 1, 2002 |
| Grant date | Feb 17, 2004 |
| Priority date | — |
| Expiry date | Feb 1, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15153
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A display device and method of fabricating the same. The display device comprises a first array of transparent conductors. The first array of transparent conductors has a first pitch defined by a first distance between adjacent transparent conductors of the first array of transparent conductors. The display device further comprises a second array of conductors disposed on a plurality of integrated circuit (IC) devices coupled to a carrier, which couples to the display device. The second array of conductors has a second pitch defined by a second distance between adjacent conductors of the second array of conductors. The first pitch and the second pitch are substantially similar. The first array of transparent conductors interconnects the second array of conductors.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.