Capacitive circuit array for fingerprint sensing
US6694269B2 · kind B2 · utility
4Cited by
8References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 23, 2001 |
| Grant date | Feb 17, 2004 |
| Priority date | — |
| Expiry date | Oct 21, 2021 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06V40/1306
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A low cost capacitive fingerprint sensor which can be fabricated on various substrates, such as large glass or plastic substrates. The sensor is made by depositing and patterning alternate layers of conductive and insulation materials. A pixel of the sensor is comprised of a pick up pad and a plurality of voltage electrodes symmetrically placed around the pick up pad. The symmetry is such that only when a finger surface ridge is present, the pick up pad registers a signal.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.