Hoop support for semiconductor wafer
US6695921B2 · kind B2 · utility
2Cited by
3References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 13, 2002 |
| Grant date | Feb 24, 2004 |
| Priority date | — |
| Expiry date | Jun 13, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S269/903
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An improved hoop support for semiconductor wafers reduces contamination of the wafer during edge beveling operations through the use of support pins that make only line contact with the wafer. The support pins are spaced around the periphery of the hoop and possess a triangular cross section. Two intersecting sides of the pins form an edge that defines the line contact with the wafer. These intersecting sides are preferably inclined relative to the wafer at an angle of between 60 and 80 degrees.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.