Treatment method of semiconductor wafers and the like and treatment system for the same
US6695926B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 2, 1999 |
| Grant date | Feb 24, 2004 |
| Priority date | — |
| Expiry date | Jul 2, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67028
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of treating semiconductor wafers in a sealed container is provided and includes transferring and vertically placing a plurality of wafers in the container and sealing the container. An inert gas is fed into the sealed container and a quantity of warm pure water is fed into the sealed container sufficient to completely submerge the plurality of wafers and establish a level of the warm pure water in the sealed container. A vapor or fog of an organic solvent is fed into at least a space in the sealed container above the level of the warm pure water and is then terminated at a prescribed time. The plurality of wafers is dried by aspirating the warm pure water through an outlet in the bottom of the container wherein the pressure in the container is reduced during the aspiration. The inert gas is fed into the sealed container until at least the termination of the drying of the plurality of wafers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.