Formula and preparation method for multi-layer chip inductor material used in very high frequencies
US6695972B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Jan 14, 2002 |
| Grant date | Feb 24, 2004 |
| Priority date | — |
| Expiry date | Feb 8, 2022 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC04B2235/767
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
This invention relates to the formula and preparation method for a multi-layer chip inductor material used in very high frequencies. The main composition of this material is planar hexagonal soft magnetic ferrite, and ingredient is low temperature sintering aid. Preparation method is a synthetic method of solid phase reaction. The sintering aid is prepared by secondary doping. By the process of ball grinding, drying, pre-calcining, ball grinding, drying, granulating, forming, sintering, and so forth, very high frequency inductor material of superior quality is obtained, realizing low temperature sintering under a temperature lower than 900° C. This invention is of low cost, high performance, suitable for multi-layer chip inductors at very high frequencies of 300M-800 MHz.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.