Method for manipulating MEMS devices, integrated on a wafer semiconductor and intended to be diced one from the other, and relevant support
US6696364B2 · kind B2 · utility
10Cited by
9References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 8, 2002 |
| Grant date | Feb 24, 2004 |
| Priority date | — |
| Expiry date | Dec 23, 2022 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81C1/0088
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A method for manipulating MEMS devices integrated on a semiconductor wafer and intended to be diced one from the other includes bonding of the semiconductor wafer including the MEMS devices on a support with interposition of a bonding sheet. The method may also include completely cutting or dicing of the semiconductor wafer into a plurality of independent MEMS devices, and processing the MEMS devices diced and bonded on the support in a treatment environment for semiconductor wafers. A support for manipulating MEMS devices is also included.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.