Photosensitive resin composition, porous resin, circuit board, and wireless suspension board
US6696529B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 27, 2000 |
| Grant date | Feb 24, 2004 |
| Priority date | — |
| Expiry date | Feb 17, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31721
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present photosensitive resin composition 2 comprises a polyamic acid resin 4, a photosensitive agent, a dispersible compound 3 dispersible in the polyamic acid resin 4, and a solvent. The porous resin is obtained by removing the solvent from the photosensitive resin composition 2 to form a composition in which the dispersible compound 3 is dispersed in the polyamic acid resin 4, removing the dispersible compound to make the composition porous, and curing the porous photosensitive resin composition. The porous resin enables forming a fine circuit pattern and has a low dielectric constant and, when used as an insulating layer of a circuit board, brings about improved high frequency characteristics.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.