Method for introducing plated-through holes into an electrically insulating base material having a metal layer on each side
US6696665B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Sep 17, 2001 |
| Grant date | Feb 24, 2004 |
| Priority date | — |
| Expiry date | Jul 24, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/135
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method for introducing plated-through holes into an electrically insulating base material includes steps of: providing an electrically insulating base material having a first surface with a first metal layer and a second surface with a second metal layer; applying an etching resist layer at least to the first metal layer; using electromagnetic radiation to remove the etching resist layer and to thereby uncover the first metal layer in regions where plated-through holes are to be produced; etching away the uncovered regions of the first metal layer as far as the first surface of the base material; and using a laser beam to produce the plated-through holes in the base material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.