Low dielectric loss signal line having a conductive trace supported by filaments
US6696906B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | May 30, 2001 |
| Grant date | Feb 24, 2004 |
| Priority date | — |
| Expiry date | Oct 9, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49156
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A circuit board or microelectronic device in which conductive signal lines are suspended or supported by filaments in air, rather than surrounded by a solid dielectric material. Dry air has a low relative permittivity and extremely low loss tangent compared with common dielectric substrates in which signal lines are currently embedded within circuit boards and microelectronic devices. The signal intensity attenuation for filament-suspended or filament-supported signal lines is much lower than signal lines embedded in solid dielectric materials, allowing for transmission of significantly higher frequency signals within filament-suspended and filament-supported signal lines.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.