High-speed package design with suspended substrates and PCB
US6697260B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 29, 2001 |
| Grant date | Feb 24, 2004 |
| Priority date | — |
| Expiry date | Apr 1, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K5/0091
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An integrated high-speed package comprising a package housing having a housing lip and connector having a center pin abutting along a bottom surface of the housing lip. For signal registration of a first substrate to the signal lead, the substrate is “floated” up to the housing lip, which provides an alignment reference to ensure that the top surface of the first substrate is aligned and in direct registration with the signal lead. In another embodiment, the center pin to substrate registration is provided at a top surface of a housing base. The housing base preferably comprises a first portion of a first height and a second portion of a second height. Accordingly, the housing base can accommodate substrates of different thickness while allowing a top surface of the first and a second substrate to be coplanar to facilitate signal registration there between.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.