Methods and systems for forming a die package
US6698092B2 · kind B2 · utility
1Cited by
5References
2Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 31, 2001 |
| Grant date | Mar 2, 2004 |
| Priority date | — |
| Expiry date | Jan 4, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49171
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
The described embodiments relate to methods and systems for forming die packages. In one exemplary embodiment, the method for forming die packages contacts interface areas of a die assembly to keep the interface areas free of an insulative material. The method distributes a flowable insulative material around portions of the die assembly.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.