Cooling device and method
US6698499B1 · kind B1 · utility
15Cited by
3References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 29, 2000 |
| Grant date | Mar 2, 2004 |
| Priority date | — |
| Expiry date | Sep 29, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A cooling device includes a heat sink assembly that may also form a housing surrounding a chamber. The housing may be constructed of a plurality of cooling vanes which have elongated openings therebetween allowing air to pass between and cool the vanes. The cooling device operates in an extremely efficient manner, for example, by causing air to pass over the cooling vanes twice.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.