Molding processes and apparatuses for forming golf balls
US6699027B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 27, 2002 |
| Grant date | Mar 2, 2004 |
| Priority date | — |
| Expiry date | Nov 27, 2022 |
Classification
- Technology area (CPC A)Human Necessities
- CPC primaryA63B37/0061
- WIPO fieldFurniture, games
- WIPO sectorOther fields
Abstract
Molding equipment and related techniques for forming a golf ball with one or more deep dimples are disclosed. The golf ball comprises a core and a cover layer, wherein the cover layer provides one or more deep dimples that extend through the cover layer to and/or into a layer or component underneath are disclosed. Preferably, the deep dimples are at least twice the depth of conventional dimples, more preferably, three or four times the depth of the conventional dimples. The deep dimples may be spherical or non-spherical, and the portion of the dimple that extends to or into the next inner layer may be the same or different shape as the outer portion of the dimple.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.