Anisotropically conductive adhesive composition and anisotropically conductive adhesive film formed from it
US6699351B2 · kind B2 · utility
5Cited by
4References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 19, 2002 |
| Grant date | Mar 2, 2004 |
| Priority date | — |
| Expiry date | Sep 19, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/323
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
To provide an anisotropically conductive adhesive composition that can be rapidly cured at a low temperature during thermocompression bonding and has a sufficiently long working life, while also exhibiting excellent mutual connection stability after connection between substrates. The anisotropically conductive adhesive composition comprises an epoxy resin comprising a cycloaliphatic epoxy resin and a glycidyl group-containing epoxy resin, an ultraviolet activatable cationic polymerization catalyst and a cationic polymerization retarder, and conductive particles.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.