Method of forming alignment features for conductive devices
US6699395B1 · kind B1 · utility
12Cited by
41References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 18, 2000 |
| Grant date | Mar 2, 2004 |
| Priority date | — |
| Expiry date | Jul 31, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49156
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method of forming a conductive device includes forming a conductive layer on a substrate; etching the conductive layer to form a plurality of conductive traces; etching the conductive layer to form at least one mask feature; and removing substrate material that is not covered by the at least one mask feature so as to form at least one mechanical alignment feature.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.