Patent · US Expired

Device and method for transferring microstructures

US6699425B1 · kind B1 · utility

7Cited by
2References
21Claims
0Family size

Assignee

Inventors

Key dates

Filing dateMay 9, 2001
Grant dateMar 2, 2004
Priority date
Expiry dateMay 9, 2021

Classification

  • Technology area (CPC G)Physics
  • CPC primaryG03F7/0002
  • WIPO fieldOptics
  • WIPO sectorInstruments

Abstract

A device and a method for transferring microstructures from a tool to a substrate which is to be structured. The device and method are intended to align the tool and the substrate in a mutually controlled manner. The device contains supports for the tool and the substrate which can be displaced in an opposing direction in relation to one another, resulting in an alteration of the distance between the tool and the substrate. A measuring system is provided which can be inserted between the supports, for measuring selected locations on at least one measuring plane. The direction of displacement of the supports is aligned vertically in relation to said measuring plane. The measuring system forms a fixed spatial relationship with the tool in a measuring position. The substrate can be aligned in relation to the tool. The method and device can be used for producing microstructured components.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.