Heat-shrinkable multilayer film
US6699549B1 · kind B1 · utility
47Cited by
2References
27Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 24, 2000 |
| Grant date | Mar 2, 2004 |
| Priority date | — |
| Expiry date | Oct 24, 2020 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31743
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A polyester-surfaced heat-shrinkable multilayer film exhibiting good printability and adaptability to various automatic packaging processes is provided, including an outer surface layer (a) comprising a polyester resin, an intermediate layer (b) comprising a polyamide resin and an inner surface layer (c) comprising a sealable resin. The film exhibits a heat-shrinkable stress at 50° C. of at most 3 MPa both in longitudinal direction and in transverse direction, and a hot water shrinkability at 90° C. of at least 20%.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.