Patent · US Expired

Bonding of thermal tile insulation

US6699555B2 · kind B2 · utility

14Cited by
15References
17Claims
0Family size

Assignee

Inventor

Key dates

Filing dateOct 25, 2002
Grant dateMar 2, 2004
Priority date
Expiry dateJan 12, 2023

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10T428/237
  • WIPO fieldMaterials, metallurgy
  • WIPO sectorChemistry

Abstract

An insulative body having first and second porous insulation members and a ceramic binder. Each of the first and second porous insulation members is formed of a fibrous, low-density silica-based material and cooperatively defines a joint. The ceramic binder is disposed between a pair of mating surfaces that form the joint. The ceramic binder couples the first and second porous insulation members together.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.