Patent · US Expired

Process for manufacturing shaped forms of packaging

US6699566B2 · kind B2 · utility

54Cited by
2References
8Claims
0Family size

Assignee

Inventors

Key dates

Filing dateOct 27, 1998
Grant dateMar 2, 2004
Priority date
Expiry dateOct 27, 2018

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10T428/31757
  • WIPO fieldOther special machines
  • WIPO sectorMechanical engineering

Abstract

Process for manufacturing cold formed shaped forms of packaging having at least one recess from a metal-plastic laminate. Examples of such shaped forms of packaging are the base parts of push-through packs or blister packs. The process is such that the laminate is held between a retaining tool and a die. The die 1 exhibits at least one opening and a stamp is driven into the die opening causing the laminate to be shape-formed into a packaging, correspondingly exhibiting one or more recesses.The die and the retaining tool exhibit facing edge regions and the die, within the edge region, exhibits a shoulder region that surrounds the die opening or openings. The surface of the shoulder region lies 0.01 to 10 mm lower than the surface of the edge region of the die, and a first stamp or first stamps with high friction forming surface form the metal-plastic laminate in one or more steps down to 100% of the final depth of the recess and subsequently a second stamp or stamps with low friction forming surface perform the final forming of the laminate in one or more steps to at least 100% of the final depth of the recess.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.