Circuit board or other multilayer electrical device made by forming teeth to join layers
US6700069B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 20, 2000 |
| Grant date | Mar 2, 2004 |
| Priority date | — |
| Expiry date | Oct 20, 2020 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24331
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A multilayer electrical device, such as a printed circuit board, having a tooth structure including a metal layer set in a dielectric. The device includes a base; a conductive layer adjacent to the base; a dielectric material adjacent to conductive layer; a tooth structure including a metal layer set in the dielectric material to join the dielectric material to the metal layer; and wherein the metal layer forms a portion of circuitry in a circuit board having multiple layers of circuitry.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.