Multi-layer interconnect module and method of interconnection
US6700076B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 1, 2002 |
| Grant date | Mar 2, 2004 |
| Priority date | — |
| Expiry date | Feb 1, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/09627
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An electronic module includes an interconnect module having a plurality of metal layers separated by a plurality of dielectric layers in a stacked structure with electronic components mounted on one surface of the module. The electronic components are selectively interconnected by drilling via holes completely through all dielectric layers with a conductive material such as solder in each via contacting metal layers to be interconnected and each metal layer which is not connected by a via having a metal pattern devoid of metal at the via location. For via connecting non-ground layers, there will be a patch of solder mask on the backside ground layer to electrically prevent this via from inadvertently connecting to ground.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.