Light emitting device package
US6700136B2 · kind B2 · utility
94Cited by
2References
23Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jul 30, 2001 |
| Grant date | Mar 2, 2004 |
| Priority date | — |
| Expiry date | Sep 26, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/8581
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A light emitting device (LED) package comprises: a thermally conductive layer; an electrically insulating layer having openings extending therethrough; LEDs situated within the openings of the electrically insulating layer and including contact pads; and electrically conductive strips attached to the contact pads and the electrically insulating layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.