Semiconductor wafer on which is fabricated an integrated circuit including an array of discrete functional modules
US6700142B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Dec 30, 2002 |
| Grant date | Mar 2, 2004 |
| Priority date | — |
| Expiry date | Dec 30, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L22/22
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention provides a semiconductor wafer that has a predetermined global functionality and comprises a top surface, a bottom surface and a peripheral edge between the top surface and the bottom surface. An integrated circuit is fabricated on the semiconductor wafer and includes a working set of discrete functional modules arranged into a central rectangular array of rows and columns defined by a boundary that includes four rectilinear sides and four corners. The integrated circuit further includes a spare set of discrete functional modules formed outside the boundary of the working set into at least one line that is disposed along a side of the rectangular array of the working set. If a discrete functional module in the working set is found to be defective, it can be replaced by a discrete functional module in the spare set.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.