Compact, surface-mounting-type, electronic-circuit unit
US6700177B2 · kind B2 · utility
3Cited by
19References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 29, 2001 |
| Grant date | Mar 2, 2004 |
| Priority date | — |
| Expiry date | Nov 12, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/0347
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
In a surface-mounting-type electronic-circuit unit, circuit elements, including capacitors, resistors, and inductive devices, and electrically conductive patterns connected to the circuit elements are formed on an alumina board as thin films. Semiconductor bare chips for a diode and a transistor are wire-bonded to connection lands in electrically conductive patterns. And end-face electrodes connected to grounding electrodes, input electrodes, and output electrodes of electrically conductive patterns are formed at side faces of the alumina board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.