Thermally conductive substrate, thermally conductive substrate manufacturing method and power module
US6700182B2 · kind B2 · utility
3Cited by
3References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 1, 2001 |
| Grant date | Mar 2, 2004 |
| Priority date | — |
| Expiry date | Sep 30, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/09145
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
By providing an end portion of a radiation plate located on and near an end portion of an insulator sheet, to which a lead frame extends, at a position away from the end portion of the insulator sheet inside of the insulator sheet in a plane direction of the insulator sheet, it is possible to secure a creeping distance between the lead frame and the radiation plate without decreasing a lead frame area on which components can be actually mounted.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.