Nested plug-in modules
US6700797B2 · kind B2 · utility
2Cited by
7References
25Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 17, 2001 |
| Grant date | Mar 2, 2004 |
| Priority date | — |
| Expiry date | Oct 17, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/1444
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A modular electronic chassis system with nested electronic plug-in modules including at least one circuit board providing a first-module-receiving-location and a second-module-receiving-location such that the system is capable of supporting modules in a nested configuration having increased packaging density. A first plug-in module detachably engaged with the first-module-receiving-location. A second plug-in module detachably engaged with the second-module-receiving-location so that the first plug-in module and the second plug-in module are nested.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.