System and method for side to side registration in a printed circuit imager
US6701197B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 23, 2001 |
| Grant date | Mar 2, 2004 |
| Priority date | — |
| Expiry date | May 18, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/09918
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method of recording aligned images on two sides of a printed circuit board substrate, including: recording an image of an electrical circuit pattern on a first side of a printed circuit board substrate; forming an alignment pattern on a side of the printed circuit board substrate, wherein the alignment pattern has a known spatial relationship to said image of an electrical circuit pattern; determining a location of the alignment pattern on the printed circuit board substrate; and recording an image of an electrical circuit pattern on a second side of the printed circuit board substrate in response to the determined location of the alignment pattern.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.