Method and apparatus for optimizing thermal solutions
US6701272B2 · kind B2 · utility
19Cited by
5References
38Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 30, 2001 |
| Grant date | Mar 2, 2004 |
| Priority date | — |
| Expiry date | Mar 30, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02D10/00
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A method and apparatus are provided for obtaining throttle settings of a system, such as a chipset. A first bandwidth may be applied to a first area (or interface) of the system and a temperature of the first area may be sensed using a thermal sensor. The bandwidth passing through this first area may be increased or decreased based on the sensed temperature to obtain an ideal or optimized setting.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.