Hydronic pump type heat radiator
US6702002B2 · kind B2 · utility
Assignees
Inventor
Key dates
| Filing date | Jun 3, 2002 |
| Grant date | Mar 9, 2004 |
| Priority date | — |
| Expiry date | Oct 4, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention provides a hydronic pump type heat radiator, which comprises an outer ring heat spreader, a plurality of outer heat-radiating fins, a plurality of inner heat-radiating fins, a cavity, and a pump. The outer ring heat spreader has an annular wall. The inside of the annular wall has a receiving space. The outer heat-radiating fins are disposed outside the outer ring heat spreader. The inner heat-radiating fins are disposed inside the receiving space of the outer ring heat spreader. The cavity is disposed between the inner heat-radiating fins and the outer ring heat spreader. The cavity is used to receive cooling liquid therein. The pump is properly connected to the cavity, and can drive the cooling liquid in the cavity to make circulative flow so as to quickly transfer heat source and have the heat-radiating function of compulsory flow of liquid.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.