Fluidic interconnect structures
US6702434B2 · kind B2 · utility
8Cited by
6References
51Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 30, 2002 |
| Grant date | Mar 9, 2004 |
| Priority date | — |
| Expiry date | Apr 30, 2022 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB41J2/17523
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
A seal septum structure includes a septum body structure fabricated of a resilient material. The body structure includes an opening formed there through and a first seal surface circumscribing the opening to engage against a needle when inserted into the opening. The body structure further includes a second seal surface for engaging against a stopper structure when the needle is not inserted into the opening. The septum structure can be over-molded on a rigid host part, or fabricated as a separate structure from the host part, and pressed in to place.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.