Patent · US Expired

Inking apparatus with multi-positioning capability

US6702489B2 · kind B2 · utility

0Cited by
4References
9Claims
0Family size

Assignee

Inventor

Key dates

Filing dateJul 3, 2002
Grant dateMar 9, 2004
Priority date—
Expiry dateJul 3, 2022

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01L2924/0002
  • WIPO fieldSemiconductors
  • WIPO sectorElectrical engineering

Abstract

An inking apparatus including an inking head which is manually adjustable in the X, Y and Z directions to facilitate quick and easy positioning of an inking probe in proximity to a defective die on a semiconductor wafer to ink and mark the die for exclusion from further processing. A horizontal positioning plate is horizontally adjustably mounted on a base plate, and an angular adjustment arm is angularly adjustably mounted on the horizontal positioning plate. The inking head is vertically adjustably mounted on the end of the angular adjustment arm and carries an ink reservoir from which ink is dispensed through an inking probe to the dies on the wafer.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.