Electrical contact for retaining solder preform
US6702594B2 · kind B2 · utility
102Cited by
9References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 14, 2001 |
| Grant date | Mar 9, 2004 |
| Priority date | — |
| Expiry date | Dec 14, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A contact for being received in an electrical socket which interconnects an integrated circuit (IC) package with a printed circuit board (PCB), comprises a contact portion for electrically connecting with a pin of the IC package, a locating portion for interferentially engaging with insulative housing of the electrical socket, and a tail portion having a plurality of clip arms. When a solder block is inserted into the tail portion, the clip arms can deflect to secure the solder block in a predetermined position in the tail portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.