Method and apparatus for monitoring polishing plate condition
US6702646B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 1, 2002 |
| Grant date | Mar 9, 2004 |
| Priority date | — |
| Expiry date | Jul 1, 2022 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B49/10
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
An apparatus for monitoring a condition of a polishing plate, in particular for detecting the time for the polishing plate to be reconditioned or replaced, comprising a measuring unit containing at least one sensing unit and a signal-conditioning unit; and a data processing unit. The measuring unit is being in contact with the polishing plate and having a possibility to move relative to it. The sensing unit comprises a probing tip and a set of sensors attached to the back surface of the probing tip, and contains at least one sensor of the group of coefficient of friction sensor, acoustic emission sensor, wear sensor. All sensors work simultaneously and their measurement data is processed and analyzed by a data processing unit for obtaining accurate and reliable results.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.