Pulsed arc molecular beam deposition apparatus and methodology
US6702934B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | May 10, 2001 |
| Grant date | Mar 9, 2004 |
| Priority date | — |
| Expiry date | Jul 16, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J37/32055
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Deposition of thin films or powders by reactive pulsed arc molecular beam deposition. To produce these films and powders, a reactive or non-reactive gas is pulsed between a pair of electrodes situated within a vacuum chamber. The gas can be either chemically inert, to produce pure cathode material films, or chemically reactive, to produce chemical compounds of the cathode material. A storage capacitor is discharged between the electrode pair during the gas pulse. The gas serves as a carrier to direct and transport the ablated material to a substrate which is placed inline with the gas pulse, on which a film or powder of the electrode material or a chemical compound of the electrode material is then coated.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.