Printed circuit techniques for polyethylene surfaces
US6702968B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 17, 2001 |
| Grant date | Mar 9, 2004 |
| Priority date | — |
| Expiry date | Nov 13, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0156
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
Electrical circuit elements such as electrically conductive strips are permanently applied to the surface of polyolefin parts, such as polyethylene parts which are manufactured by rotational molding, by use of a transfer which can be applied to the interior surface of a rotational mold at the start of the molding cycle or can be applied to the molded part after its formation. The transfer comprises a carrier sheet on which the conductive circuit elements are printed with a mixture of wax or polyethylene powders containing from 30 to about 60 weight percent of conductive particles, preferably metal flakes. After application, the carrier sheet is removed and the conductive circuit elements are permanently incorporated into the surface of the polyethylene part by heating, either during the rotational molding cycle or by post-cycle heating of the formed part.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.